JPH0453097B2 - - Google Patents

Info

Publication number
JPH0453097B2
JPH0453097B2 JP61182821A JP18282186A JPH0453097B2 JP H0453097 B2 JPH0453097 B2 JP H0453097B2 JP 61182821 A JP61182821 A JP 61182821A JP 18282186 A JP18282186 A JP 18282186A JP H0453097 B2 JPH0453097 B2 JP H0453097B2
Authority
JP
Japan
Prior art keywords
cutting
semiconductor device
outer lead
printed circuit
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP61182821A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6340329A (ja
Inventor
Minoru Okamura
Fumimaro Ikeda
Hideaki Myoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
NEC Corp
Original Assignee
Kaijo Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp, Nippon Electric Co Ltd filed Critical Kaijo Corp
Priority to JP61182821A priority Critical patent/JPS6340329A/ja
Publication of JPS6340329A publication Critical patent/JPS6340329A/ja
Publication of JPH0453097B2 publication Critical patent/JPH0453097B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP61182821A 1986-08-05 1986-08-05 アウタ−リ−ドボンディング装置 Granted JPS6340329A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61182821A JPS6340329A (ja) 1986-08-05 1986-08-05 アウタ−リ−ドボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61182821A JPS6340329A (ja) 1986-08-05 1986-08-05 アウタ−リ−ドボンディング装置

Publications (2)

Publication Number Publication Date
JPS6340329A JPS6340329A (ja) 1988-02-20
JPH0453097B2 true JPH0453097B2 (en]) 1992-08-25

Family

ID=16125045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61182821A Granted JPS6340329A (ja) 1986-08-05 1986-08-05 アウタ−リ−ドボンディング装置

Country Status (1)

Country Link
JP (1) JPS6340329A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0767025B2 (ja) * 1988-04-26 1995-07-19 株式会社カイジョー アウターリードボンディング装置
JPH01273397A (ja) * 1988-04-26 1989-11-01 Marine Instr Co Ltd アウターリードボンディング装置における半導体チップ移送装置

Also Published As

Publication number Publication date
JPS6340329A (ja) 1988-02-20

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